While inline solutions with die bonders reduce the productivity and flexibility of SMT placement lines, ASM offers a smart combination solution to decouple the wafer handling from the flip-chip placement process. In the course of miniaturization, individual dies or flip-chips are increasingly being assembled in SiPs (System in Package), submodules and small assemblies in addition to SMT components. Previous inline solutions require complex wafer handling on the SMT line and slow down placement performance with comparatively slow flip-chip or die bond processes. Now ASM presents a new, significantly more efficient solution.
First flip, then chip: Decouple wafer handling and SMT process The basic idea: Why complicate the SMT line unnecessarily by integrating a die bonder and reduce its placement performance? ASM therefore decouples wafer handling and flip-chip assembly in two process steps and systems. The result is a significant gain in flexibility and productivity for electronics manufacturers.
ASM SUNBIRD is a system for inspection, sorting and taping. With the ASM SUNBIRD turret head, 6-sided optical inspection, electrical function testing, laser marking, sorting and packing can be efficiently combined. The dies are removed from the wafer and then go through all process steps offered in ASM SUNBIRD.
Up to 30,000 of these can be inspected, tested, marked and taped fully automatically per hour. The result is tapes in which the dies are simply stored and already flipped for SMT placement.
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SIPLACE TX micron meets the increased requirements in SiP/Advanced Packaging and submodule production - with an extremely high assembly capacity at the same time. Through the interaction of special glass-ceramic scales, high-resolution vision system, vacuum tools, high-precision linear motors and control software, the SIPLACE TX micron with two SIPLACE SpeedStar placement heads achieves a placement accuracy of 15µm @ 3 sigma at placement rates of up to 78,000 BE/h (components per hour).
All this enables the flip-chips equipped in the tapes to be assembled precisely, highly efficiently and in combination with other SMT components down to component sizes of 0402 (metric).