The ASM SilverSAM is a single platform that can be used both in R&D activities and a multi-press configuration for running high-volume production with pressure sintering applications.
The ASM SilverSAM-m is a semi-automatic version that provides the necessary flexibility required in R&D, NPI or low-volume production. The ASM SilverSAM-auto is a fully automatic platform that can run up to 3 presses in parallel which can be scaled according to ramp-up and high volume scenarios.
The beauty of this system is that tooling and recipes are fully portable between both machines. The common platform makes the ASM SilverSAM the perfect solution to accompany and support our customers from product development to series production.
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Back Side Metallization - High throughput solution for thick and thin films and multiple wafer sizes.
Multi-beam laser dicing of SiC wafers at extremely low thermal impact while having very high productivity.
Extremely powerful, modular and flexibly configurable solution for use in advanced-packaging processes.
Automatic Encapsulation Solution for Power Module and Double-Sided-Cooling (DSC) packages.
If you need further information, please do not hesitate to contact us! The ASM team looks forward to answering your questions.