As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.
Automatic Die Bonder for a wide range of applications
High Precision Wafer & Panel Level Bonder
Automatic Die Bonder for optical & photonic applications
ASMPT's complete portfolio for wafer level and panel level packaging technologie.
Highest precision for Photonic & Advanced Packaging applications.
Highest Speed Die Bonding & SMD Placement.